The USD/JPY rose more than 30 points against the Japanese yen in the short term and is now reported at 152.56.Another member of South Korea's ruling party said he would vote to impeach President Yoon.It is reported that NVIDIA has increased its recruitment in China, and it is expected to add 1,000 employees this year. According to people familiar with the matter, NVIDIA has increased its recruitment in China this year to enhance its research ability and focus on new autonomous driving technology. According to sources, the company is expected to have about 4,000 employees in China by the end of this year, compared with about 3,000 at the beginning of this year. As a key part of the expansion, NVIDIA added about 200 employees in Beijing to strengthen a research team engaged in autonomous driving research. One person familiar with the matter said that the company has also expanded its after-sales service and network software development team.
India's NIFTY 50 index fell, with the latest drop of 0.1%.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)Hua Fu Securities completed the capital increase and share expansion of over 4.7 billion yuan, and the Shanghai United Assets and Equity Exchange issued a closing announcement: the capital increase and share expansion project of Hua Fu Securities was launched. There were 17 participants in this capital increase, including 4 original shareholder units and 13 new investors, with a total investment of about 4.757 billion yuan. According to China, a brokerage firm, Hua Fu Securities' capital increase and share expansion has attracted wide attention in the market, becoming the largest equity financing case in the securities industry this year.
Pakistan KSE-100 index rose 0.5% to 111,504.90.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)The passenger throughput of airports in Shanxi Province exceeded 20 million passengers. The reporter learned from Shanxi Aviation Industry Group Co., Ltd. on the 12th that as of December 10th, the passenger throughput of airports in Shanxi Province exceeded 20 million passengers, 14 days earlier than that in 2019, realizing a new leap-forward development. (China News Network)
Strategy guide 12-14
Strategy guide 12-14
Strategy guide
12-14
Strategy guide 12-14